IEEE

Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing

Abstract: We describe here Intel's 14nm high-performance logic technology interconnects and back end stack featuring 13 metal layers and a tri-metal laminated metal-insulator-metal (MIM) capacitor.
GitHub

We have made you a wrapper you can't refuse

We have a vibrant community of developers helping each other in our Telegram group. Join us! Stay tuned for library updates and new releases on our Telegram Channel. This library provides a pure ...

How recruitment fraud turned cloud IAM into a $2 billion attack surface

Adversaries weaponized recruitment fraud to steal cloud credentials, pivot through IAM misconfigurations, and reach AI ...

So yeah, I vibe-coded a log colorizer—and I feel good about it

Oh, sure, I can “code.” That is, I can flail my way through a block of (relatively simple) pseudocode and follow the flow. I ...