New DVT MCP Server Product Is Available in Latest Release This release is a major milestone for both our team and our ...
Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design.” Abstract “While Large Language Models (LLMs) show ...
Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 ...
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