Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.
Although we can already buy commercial transceiver solutions that allow us to use PCIe devices like GPUs outside of a PC, ...
Abstract: This article focuses on failure modes and lifetime testing of IGBT modules being one of the most vulnerable components in power electronic converters. IGBT modules have already located ...
Abstract: 3D integration photonic interposer is becoming popular in the field of co-packaging optics (CPO). In this paper, we integrate the edge coupler and through silicon via (TSV) into the silicon ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results