For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far ...

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Abstract: Diagnosing interconnect line defects becomes increasingly challenging in advanced chiplet integration due to the immaturity of fabrication processes, reduced interconnect spacing, and ...

Abstract: Electromigration, driven by increasing current densities in scaled integrated circuits, poses a serious reliability challenge in semiconductor manufacturing, often culminating in void ...

Keysight Technologies, Inc. and Point2 Technology have announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up connectivity ...