The technology is based on a vertically integrated design that bonds two chips into a single stack. By tightly coupling these silicon layers, Broadcom's engineers aim ...

Researchers from the University of Maryland, Lawrence Livermore, Columbia and TogetherAI have developed a training technique that triples LLM inference speed without auxiliary models or infrastructure ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

The industry’s response is to split compute, memory, and I/O across dies, XPU chiplets are pushing toward the reticle limit, and stitch it all together with high‑bandwidth, energy‑efficient die‑to‑die ...