AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...
Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...
A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
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