The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

Download this eBook to learn how to improve overall quality control in the production area and gain insight into machine set-up with pressure mapping technology. This eBook explores various packaging ...

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions point to potential M&A activity that could affect the semiconductor equipment ...

Many packaging companies are turning to systems that combine the stretch blow molding (SBM) process with the bottling process in a single production flow. Pneumatic technologies can solve PET ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...