Si2 announced that Cadence has donated extensions to the OpenAccess community which enable physical design tools to represent Multi-Patterned Technology (MPT). Conventional photolithography cannot ...

Layout decomposition represents a critical step in the semiconductor manufacturing process, whereby integrated circuit designs are partitioned into multiple layers or masks to overcome the inherent ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

New dry resist technology being developed with ASML and imec will help to extend EUV lithography’s resolution, productivity and yield FREMONT, Calif., Feb. 26, 2020 (GLOBE NEWSWIRE) -- Lam Research ...

Traditional immersion lithography approached its limits years ago, and chipmakers adopted nonlitho workarounds, such as multiple patterning that uses advanced etch and deposition tools from other ...

Canon launched its Nanoimprint Lithography semiconductor manufacturing equipment, which has the potential to compete with ASML's EUV technology currently in production at 4nm. Canon's first planned ...

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of ...

ASML is the dominant leader in the semiconductor lithography market, and its EUV system sales represented 32% of overall revenues for the company in 2019. ASML dominates the semiconductor lithography ...