Experts at the Table: Semiconductor Engineering sat down to explore how AI impacts design for testability, with Jeorge Hurtarte, senior director of product marketing in the Semiconductor Test Group at ...
The dramatic rise in manufacturing test time for today’s large and complex SoCs is rooted in the use of traditional approaches to moving scan test data from chip-level pins to core-level scan channels ...
January 25, 2013. At the European 3D TSV Summit in Grenoble, France, on January 22-23, 2013, imec announced that together with Cadence Design Systems they have developed, implemented, and validated an ...
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